Multilayer ceramic electronic component including plating material of external terminal electrode disposed in voids of inner conductor and method for manufacturing the same

摘要

A multilayer ceramic electronic component includes external terminal electrodes that are formed by direct plating on the first and second side surfaces of a ceramic body including stacked ceramic layers and inner conductors. The external terminal electrodes include base plating films formed so as to cover the exposed portions of inner conductors. Voids are provided that are open to the side surfaces of the ceramic body so as to be adjacent to the ends in the width direction of the exposed portions of the inner conductors. A plating metal defining the base plating films enters the voids and is electrically connected to the inner conductors in the ceramic body.