发明名称 Inspection method for semiconductor wafer and apparatus for reviewing defects
摘要 An object of the present invention is to provide a suitable method of observing a wafer edge by using an electron microscope. The electron microscope includes a column which can take an image in being tilted, and thus allows a wafer edge to be observed from an oblique direction.
申请公布号 US8309919(B2) 申请公布日期 2012.11.13
申请号 US20090352357 申请日期 2009.01.12
申请人 OBARA KENJI;HIRAI TAKEHIRO;HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 OBARA KENJI;HIRAI TAKEHIRO
分类号 G01N23/00;A61N5/00;G21K7/00 主分类号 G01N23/00
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