发明名称 |
Method of fabricating a light emitting diode chip having phosphor coating layer |
摘要 |
A method of fabricating light emitting diode chips having a phosphor coating layer comprises providing a substrate having a plurality of light emitting diodes formed thereon; forming a conductive bump on at least one of the plurality of light emitting diodes; forming a phosphor coating layer over the substrate and the light emitting diodes; cutting the phosphor coating layer by a point cutter to remove an upper portion of the phosphor coating layer, so as to reduce a thickness of the phosphor coating layer and expose the conductive bump; and forming a plurality of individual light emitting diode chips having the phosphor coating layer by separating the plurality of light emitting diodes. |
申请公布号 |
US8309378(B2) |
申请公布日期 |
2012.11.13 |
申请号 |
US201113229994 |
申请日期 |
2011.09.12 |
申请人 |
HSIEH CHUNG-CHUAN;EVERLIGHT ELECTRONICS CO., LTD. |
发明人 |
HSIEH CHUNG-CHUAN |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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