| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing device which allows easy maintenance work. <P>SOLUTION: A storage area 202 provided with a storage part 12 and a cleaning area 208 provided with a cleaning part 16 are arranged on the front side of a device body 200. A workpiece feed area 204 provided with a workpiece feed part 14A for sending a wafer W to a cutting part 14B is arranged between the storage area 202 and the cleaning area 208, and is located at a position retracted from the front side further than the storage area 202 and the cleaning area 208. Consequently, the distance from the device front side to the cutting part 14B can be shortened. A maintenance cover 174 is openably and closably attached to a maintenance area 212 which is formed in a recessed manner on the front side of the device body 200 as a result of arranging the workpiece feed area 204 at the retracted position. <P>COPYRIGHT: (C)2013,JPO&INPIT |
