| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin film processing method obtainable of a resin film which can be easily broken from both sides of an area having a recessed part when forming the recessed part such as a half cut part in the resin film by using laser beam, and to provide a resin film formed by the resin film processing method. <P>SOLUTION: A heat generating layer for generating the heat by absorbing the laser beam at the rate higher than that of a resin film is formed on the other side of a resin film. One surface side of the area in the resin film, to which the laser beam is irradiated, is made to generate heat by irradiating the laser beam to the area corresponding to the heat generating layer in one side of the resin film. The other surface side of the area in the resin film, to which the laser beam is irradiated, is heated by the heat generating layer which generates heat by absorbing the laser beam transmitted through the resin film. Thereby, a pair of recessed parts are formed at the corresponding positions of both sides of the resin film. <P>COPYRIGHT: (C)2013,JPO&INPIT |
