| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a conductive material layer is bonded to a heat sink without using a resin sheet. <P>SOLUTION: Semiconductor devices 1, 2 according to the present invention each comprises a heat sink 40, an insulation layer 30 formed by spray coating of an insulating material not containing resin directly on the heat sink 40; a conductive material layer 20 formed by spray coating of a conductive material directly on the insulation layer 30; and a chip 10 including a semiconductor element provided on the conductive material layer 20. Preferably, the insulating material is AlN, SiN or Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>. <P>COPYRIGHT: (C)2013,JPO&INPIT |
