| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the influence on thin film deposition on a substrate in a plasma CVD deposition process for forming the thin film on the substrate by plasma CVD, by lowering adsorption probability of a thin film component onto a substrate mounting part. <P>SOLUTION: The influence on thin film deposition on a substrate is reduced by lowering adsorption probability of a thin film component onto a substrate mounting part by allowing an upper surface of a substrate mounting part configured to mount the substrate thereon to be a smooth surface. The substrate mounting part includes a holding member for holding the substrate. In the upper surface configured to mount the substrate thereon in the surface of the holding member, the smooth surface at least is a region which is not covered with the substrate and is exposed, with the substrate mounted thereon. The adsorption probability of the thin film ingredient onto the substrate mounting part is lowered by allowing the upper surface of the holding member to be the smooth surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
