| 摘要 |
PURPOSE: A rear-side lamp image sensor is provided to counteract compressive stress applied to a device substrate by forming a material layer on the rear side of the device substrate which transfers tensile stress to the device substrate. CONSTITUTION: A device substrate(32) comprises a front side and a rear side which is on a side opposite to the front side. Radiation sensitive areas(40,42) operate in order to detect radiation waves which enter the device substrate. An interactive link structure(65) is placed on the front side of the device substrate. A buffer layer(70) is formed on the interactive link structure. A carrier substrate(75) is welded to the device substrate through the buffer layer. A material layer is formed on the rear side of the device substrate and transfers tensile stress to the device substrate. [Reference numerals] (AA) Thinning process |
