| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board for which a gap between a through-hole and a through conductor can be suppressed, and its manufacturing method. <P>SOLUTION: The wiring board includes an insulation plate 1 having a through-hole 2 passing through from an upper surface to a lower surface, and a through conductor 3 which is disposed inside the through-hole 2 and whose side face is in contact with an inner side face of the through-hole 2, and the through conductor 3 is formed by sintering metal particles and contains conductive particles 4 not to be contracted at the temperature of the sinter. A contraction amount of the through conductor 3 (metal paste) during the sinter is suppressed by the conductive particles 4, and the generation of a gap between the through conductor 3 and the through-hole 2 is suppressed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
