| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sensor module capable of suppressing degradation of detection characteristics while being thinner. <P>SOLUTION: A sensor module 1 comprises: a first planar surface 11; a second planar surface 12 coupled to the first planar surface 11 at a right angle; a third planar surface 13 coupled to the first planar surface 11 and the second planar surface 12 at right angles; and a fourth planar surface 14 opposing to the first planar surface 11 and serving as an attachment surface to an external member. The first planar surface 11 comprises: a support member 10 having a support face 11a caved-in from the first planar surface 11; and an IC chip 20 having a connection terminal 22 on an active surface 21 side and a non active surface 29 side parallel with the active surface 21 and attached to each surface 11a, 12, 13 of the support member 10; and a vibration gyro element 30 having a connection electrode 39. The vibration gyro element 30 is arranged on the active surface 21 side of the IC chip 20, and the connection electrode 39 is mounted to the connection terminal 22 of the IC chip 20 such that a principal surface 30a is parallel with each surface 11a, 12, 13 of the support member 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
