| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress occurrence of crystal grain for reducing roughness on the side surface of an optical waveguide structure, relating to a method of manufacturing an optical integrated device which includes two or more times of butt joint steps. <P>SOLUTION: A first semiconductor lamination part is grown on an InP substrate. An etching mask 30 containing a first stripe-like position 31 that covers a first portion of an optical waveguide scheduled region A extending in a <011> direction of the InP substrate is formed for wet-etching. A second semiconductor lamination part is selectively grown. An etching mask 50 containing a second strip-like portion 51 that covers the first portion of the optical waveguide scheduled region A and a second portion which adjoins the first portion is formed, for wet-etching. A third semiconductor lamination part is selectively grown. A pair of side edges 51a of the second stripe-portion 51 are formed further inside a pair of side edges 31a of the first strip-like portion 31 (closer to the optical waveguide scheduled region A). <P>COPYRIGHT: (C)2013,JPO&INPIT |
