发明名称 BREAK DEVICE, AND BREAK METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a break device for breaking a brittle material substrate along a scribe line in a noncontact state. <P>SOLUTION: The break device includes a table 2 for placing a face formed with the scribe line S in an attitude facing upward, a holding means 11 holding the brittle material substrate W to a constant position on the table 2, and a suction pad 21 disposed above the table 2, the suction pad 21 includes a decompressed space P generating an upward sucking action on the lower surface side and an ejection port 23 ejecting downward air from portions on at least both right and left sides embracing the decompressed space P, the scribe line S is sucked by the upward sucking action of the decompressed space P of the suction pad 21, at the same time, both right and left sides of the scribe line S are pressed downward by air ejected from the ejection port 23, and the brittle material substrate W is thereby broken. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012218245(A) 申请公布日期 2012.11.12
申请号 JP20110084775 申请日期 2011.04.06
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 TOMINAGA KEISUKE
分类号 B28D5/00;C03B33/033;H01L21/301 主分类号 B28D5/00
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