| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component which reduces influence from thermal stress applied to the electronic component on a mounting substrate, without reduction in electrical connection reliability between the electronic component and the mounting substrate. <P>SOLUTION: An electronic component in the embodiment is an acceleration sensor chip, which is an MEMS chip. The acceleration sensor chip comprises a chip body 2 composed of a bottom plate part 4 formed of a glass substrate, a frame body part 5 formed of a silicon semiconductor substrate, and a lid plate part 6 formed of a glass substrate, and a solder mounting pad 3. According to the embodiment, the stress derived from thermal stress applied in the diagonal direction due to thermal expansion or heat shrinkage can be reduced, even in the case of solder mounting an electronic component having a rectangular bottom face. <P>COPYRIGHT: (C)2013,JPO&INPIT |
