| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to easily perpendicularly laminate semiconductor chips in which width is different by separating first semiconductor chips after mounting second semiconductor ships having small width on a substrate in which the first semiconductor chips are formed. CONSTITUTION: A first semiconductor chip(110) is mounted on a circuit board(10). A second semiconductor chip(120) is formed on the first semiconductor chip. A first under-fill(150) covers an interval between the first semiconductor chip and the second semiconductor chip, and a side of the first semiconductor chip. An interval between the first semiconductor chip and the circuit board is filled with a second under-fill(160). A first connection pattern(130) electrically connects the circuit board to the first semiconductor chip. A second connection pattern(140) electrically connects the first semiconductor chip to the second semiconductor chip. |
