发明名称 HIGH DENSITY ELECTRICAL INTERCONNECT FOR PRINTING DEVICES USING FLEX CIRCUITS AND DIELECTRIC UNDERFILL
摘要 PURPOSE: A high density electricity interconnector using a flexible circuit and a dielectric under fill for a printing device is provided to use an under fill after attaching a flexible circuit so that removing a separator from the top of a piezoelectric element is not needed. CONSTITUTION: A method for forming an inkjet print head comprises next steps. A piezoelectric element array including a plurality of piezoelectric elements is attached on a diaphragm(36). A plurality of conductive flexible printed circuit electrodes of the flexible printed circuit is electrically joined to a plurality of conductive piezoelectric elements for forming one or more spaces in between the diaphragm and a flexible printed circuit. A liquid under fill is distributed into the inside of the one or more spaces between the diaphragm and a flexible printed circuit. The liquid under fill is solidified for sealing the piezoelectric elements in the inside of the liquid under fill.
申请公布号 KR20120124034(A) 申请公布日期 2012.11.12
申请号 KR20120044614 申请日期 2012.04.27
申请人 发明人
分类号 B41J2/045;B41J2/175 主分类号 B41J2/045
代理机构 代理人
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