| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad having a polishing layer made of fabric capable of improving flatness of a wafer and stabilizing a polishing rate, in which supply of slurry and discharge of waste liquid are controlled in a well-balanced manner. <P>SOLUTION: The polishing pad is formed with the polishing layer 1 and a support layer 3 laminated together. In the polishing pad, the polishing layer 1 is made of the fabric 6 with mesh opening of 50 to 200 μm and thickness of 100 μm or below, and a groove 5 is formed in the support layer 3. The groove 5 communicates to a polishing surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
