| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing method capable of fixing the width of a region on the periphery of a substrate from where a coating film is removed, even if the external-diameter of each substrate varies. <P>SOLUTION: While rotating a substrate having a coating film formed on the surface, rinse liquid is supplied from a rinse liquid supply section 80 to the surface on the periphery of the substrate, and the coating film at a position supplied with the rinse liquid is removed selectively. In such a substrate processing method, when the substrate is conveyed previously by a substrate conveyance section A3, a detection section 5 provided in the substrate conveyance section A3 detects the position on the periphery of the substrate, and the position of the rinse liquid supply section 80 is determined based on the position thus detected when the rinse liquid is being supplied to the surface of the peripheral part. <P>COPYRIGHT: (C)2013,JPO&INPIT |
