| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ultra thin copper foil with a very low profile copper foil as a carrier provided with an ultra thin copper foil having good antioxidant properties and etching properties, and still having excellent peelable characteristics even at a high temperature high-pressurized environment, and a carrier showing thickness uniformity and having very few pinholes. <P>SOLUTION: The manufacturing method of the ultra thin copper foil with a very low profile copper foil as a carrier includes: preparing a release layer on a carrier of a very low profile copper foil having smooth surfaces of both sides, roughness of below 1.5 μm, and thickness of 18 to 35 μm by electroplating using a plating liquid composed of metal ions of molybdenum, nickel, chromium, and potassium; preparing a protection layer of the release layer on the release layer by plating using a plating liquid composed of 10 to 60 g/L Cu<SB POS="POST">2</SB>P<SB POS="POST">2</SB>O<SB POS="POST">7</SB>3H<SB POS="POST">2</SB>O, 100 to 400 g/L K<SB POS="POST">4</SB>P<SB POS="POST">2</SB>O<SB POS="POST">7</SB>, with pH of 6 to 10, at 10 to 60°C of a bath temperature, under a current density of 1 to 5 A/dm<SP POS="POST">2</SP>; and preparing an ultra thin copper foil with a thickness of 1 to 6 μm by further plating using a plating liquid composed of 50 to 100 g/L copper, 90 to 125 g/L sulfuric acid, at 40 to 70°C of a bath temperature, under a current density of 10 to 50 A/dm<SP POS="POST">2</SP>. <P>COPYRIGHT: (C)2013,JPO&INPIT |
