| 摘要 |
A light emitting diode package and a manufacturing method thereof are provided to increase an adhesion area between a lens and an adhesive by discharging air trapped between the lens and the adhesive via an air hole. A package body(1) has a groove formed on a center portion. A light emitting diode(2) is formed on a surface of the package body, and is electrically connected to an external circuit via a lead wire(3). A lens(4) is attached to an upper portion of the light emitting diode. At least one air hole(5) is formed on the package body to discharge air from the groove of the package body. The air hole has a size gradually increasing from an inside of the groove of the package body to an outside of the groove. |
