| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a die position determination system for determining a position of a die to be suctioned by a suction nozzle, achieving both of production efficiency improvement and die yield improvement. <P>SOLUTION: A die position determination system comprises: reference position marks 41 provided at two positions on an upper surface of a wafer palette 22; storage means for previously storing die arrangement positional information created in a coordinate system of the wafer palette 22 using the positions of the reference position marks 41 as a reference; a camera for imaging the two reference position marks 41 on the wafer palette 22 set at a predetermined position of a die pickup device; means for recognizing the positions of the reference position marks 41 in a machine coordinate system of the die pickup device by processing the captured image; and means for calculating a positional shift amount in the coordinate system of the wafer palette 22 with respect to the machine coordinate system of the die pickup device. The system acquires arrangement positions of respective dies 21 in the machine coordinate system of the die pickup device by correcting the die arrangement positional information by using the positional shift amount. <P>COPYRIGHT: (C)2013,JPO&INPIT |
