| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper bonding wire which can be sufficiently bonded at an initial stage in an opening of an aluminum electrode without damaging a dielectric film of a lower part of the aluminum electrode by impact generated when a ball comes into contact with the aluminum electrode at the bonding time, and furthermore without crushing the ball into a pedal shape too much. <P>SOLUTION: A copper bonding wire contains copper as a main component, and sulfur of 0.1 mass ppm or more and 3 mass ppm or less and palladium of 400 mass ppm or more and 5000 mass ppm or less are added thereto. <P>COPYRIGHT: (C)2013,JPO&INPIT |
