| 摘要 |
<P>PROBLEM TO BE SOLVED: To inhibit occurrence of fault of a semiconductor device due to a resin covering wires. <P>SOLUTION: A semiconductor device manufacturing method comprises: arranging a semiconductor chip 10 on a wiring board 20; subsequently, connecting the semiconductor chip 10 and the wiring board 20 with bonding wires 30; subsequently, coating an insulation film 32 on at least a part of the bonding wires 30; and subsequently encapsulating the semiconductor chip 10 and the insulation film 32 by an encapsulation resin. Accordingly, the insulation film 32 does not act as a foreign material to cause bonding fault. <P>COPYRIGHT: (C)2013,JPO&INPIT |
