| 摘要 |
<P>PROBLEM TO BE SOLVED: To assure a sufficient area connected to a radiator on an LED package substrate bottom surface, and a sufficient electric connection part area at an upper end part, with a material cost being reduced, to attain a lower cost. <P>SOLUTION: An LED package substrate has a lamination structure in which a metal layer is joined with the top of a metal plate with an insulating layer composed of a resin layer interposed therebetween. The metal plate has a constant plate thickness and has a flat bottom part having a sufficient area for forming an LED chip attaching part and a connection part of the LED chip on its upper surface, and a pair of wall part tip ends raised from both sides of the bottom part end and drawn to be bent outwards each other. R1>R2 is established, where R1 is a bending radius of a corner part where a wall part is raised from the flat bottom part of the metal plate, and R2 is a bending radius of the corner part between the wall part and the upper end part that extends outward. A pair of connection electrodes are formed on the tip end side upper surfaces where the wall part tip ends have been bent outward each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
