发明名称 CHIP TYPE SOLID ELECTROLYTIC CAPACITOR AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a chip type solid electrolytic capacitor which reduces peeling on joining surfaces of an outer cover resin and an insulation member part on an electrode substrate and prevents the increase of the equivalent series resistance (ESR). <P>SOLUTION: At least parts of one surface of an electrode substrate 4 and a surface of an outer cover resin 8 joining to the one surface of the electrode substrate 4 include elastic connection parts 9 formed by elastic adhesive members. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012222262(A) 申请公布日期 2012.11.12
申请号 JP20110088813 申请日期 2011.04.13
申请人 NEC TOKIN CORP 发明人 MEGURO KENJI
分类号 H01G9/08;H01G9/00;H01G9/004;H01G9/06 主分类号 H01G9/08
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