| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board and a method of manufacturing a liquid jetting head, wherein degradation of characteristics and quality can be suppressed by reducing film damage due to oxygen plasma ashing processing. <P>SOLUTION: The method of manufacturing a channel formation substrate 10 includes: a patterning process of patterning a lead electrode 90 and an island-shaped count mark 120 via a resist pattern 160; and an ashing process of releasing the resist pattern 160 by an oxygen plasma after the patterning process. In the patterning process, a method of setting a plane shape of the count mark 120 on the basis of a releasing characteristic of the resist pattern 160 in the ashing process is adopted. <P>COPYRIGHT: (C)2013,JPO&INPIT |
