发明名称 FILM DEPOSITION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a film deposition apparatus having an optical film thickness monitor capable of measuring the thickness of an optical thin film to be deposited with high accuracy without using any special light source with the increased quantity of light or any special detector of high sensitivity. <P>SOLUTION: The film deposition apparatus is provided with an optical film thickness monitor including: a monitor substrate; a light emission means which is installed outside a vacuum chamber to emit the monitor light to the monitor substrate via a transparent window; a light receiving means for receiving the monitor light which is reflected by the monitor substrate and guided outside the vacuum chamber; and a means for calculating the film thickness of a thin film to be deposited on a member to be film-deposited from the change in intensity of the monitor light measured by the light receiving means. The monitor substrate has a first thin film consisting of a semiconductor with its film thickness being <100 nm on its plane surface. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012219281(A) 申请公布日期 2012.11.12
申请号 JP20110082827 申请日期 2011.04.04
申请人 MITSUBISHI ELECTRIC CORP 发明人 IZUMO MASAO
分类号 C23C14/54 主分类号 C23C14/54
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