SEMICONDUCTOR DEVICE, CONNECTOR AND METHOD FOR MANUFACTURING THE DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing its manufacturing cost.

SOLUTION: A semiconductor device comprises: a die pad 101; a semiconductor element 1 having at least three terminals, a first terminal 1a of which is electrically connected to an upper surface of the die pad 101; a first lead L1 electrically connected to the die pad 101; a connector S having a first connecting member S1 having one end electrically connected to a second terminal 2b of the semiconductor element and having conductivity, a second connecting member S2 having one end electrically connected to a third terminal 1c of the semiconductor element and having conductivity and a support member S3 for supporting between the first connecting member S1 and the second connecting member S2; a second lead L2 having one end electrically connected to the other end of the first connecting member S1; a third lead L3 having one end electrically connected to the other end of the second connecting member S2; and a mold resin 102 for sealing in a state in which the support member S3 is exposed. At least a part of the support member S3 is cut so as to insulate between the second lead L2 and the third lead L3.

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