| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic circuit board structure capable of realizing high density mounting at low cost. <P>SOLUTION: An electric circuit board structure comprises: an integrated circuit 1 having a plurality of terminals 101 in a mounting face thereof; a first face on which other electronic components are mounted; and a second face opposed to the first face. The first face and the second face are provided with conductor patterns 203, 204. The electric circuit board structure further comprises: a first circuit board 2 made with a double-sided board provided with a via hole 205 thereon for conduction between the first face and the second face; and a second circuit board 3 attached to the second face of the first circuit board 2 for covering a mounting area of the integrated circuit 1 and provided with a conduction pattern 301 for connected with a part of the terminals of the integrated circuit 1 through the via hole 205 of the first circuit board 2. A part of terminals of the integrated circuit 1 are electrically connected to the conduction patterns 203, 204 of the first circuit board 2 through the conduction pattern 301 of the second circuit board 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
