| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus which improves the density and the uniformity of plasma. <P>SOLUTION: A plasma processing apparatus includes: a vacuum chamber 11 having a processing chamber 50 housing a substrate Sb; a high frequency antenna 20 outputting electromagnetic waves to the processing chamber 50; and a dielectric window 12 disposed between the high frequency antenna 20 and the processing chamber 50 and serving as an introduction port of the electromagnetic waves. A window part introducing the electromagnetic waves to the processing chamber 50 and a reinforcement part thicker than the window part are integrally formed with the dielectric window 12. <P>COPYRIGHT: (C)2013,JPO&INPIT |
