| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a through-hole substrate and a manufacturing method thereof which can enhance shape accuracy, such as roundness of an opening. <P>SOLUTION: A substrate 3 having a through-hole 2 filled with filler 4 is prepared. A structure 6, whose surface is at least partially insulated, is formed on a surface of the substrate 3. After a plating layer 7 is formed on the substrate having the structure 6 formed thereon, the filler 4 and the structure 6 are removed, thereby forming a through-hole substrate 8 in which the plating layer 7 having an opening 9 in communication with the through-hole 2 is disposed at least on one surface of a substrate 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
