| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an acrylic thermosetting adhesive composition capable of bonding satisfactorily a resin board such as a polyimide film to a polyimide film, a metal sheet or a glass epoxy board, and of exhibiting a satisfactory ambient temperature storage characteristic over a long period of several months, in the acrylic thermosetting adhesive composition used for bonding in a field of a flexible printed board or the like. <P>SOLUTION: The thermosetting adhesive composition contains an acrylic copolymer (A), an epoxy resin (B), an epoxy resin curing agent (C) and a silane coupling agent (D). The acrylic copolymer (A) is obtained by copolymerizing 65-75 mass% of epoxy group non-containing (metha)acrylate monomer (a), 20-35 mass% of acrylonitrile monomer (b), and 1-10 mass% of epoxy group containing (metha)acrylate monomer (c). The epoxy resin curing agent is an organic acid dihydrazide particle having 0.5-15 μm of average particle size. The silane coupling agent (D) is a vinyl trialkoxy silane. <P>COPYRIGHT: (C)2013,JPO&INPIT |
