| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure in which semiconductor wafers are bonded with each other. <P>SOLUTION: A semiconductor wafer manufacturing method of forming vias penetrating a plurality of semiconductor wafers comprises: detecting each chip before laminating the wafers to preliminarily remove a part of a via land by using means such as a medicine solution in the case where a defective chip is found, so as not to electrically connecting the via land and the through via; subsequently, laminating the semiconductor wafers; and forming the through vias from a surface on the side opposite to a bonded surface. As a result of removal of a part of the via land, a configuration such that the through vias and the defective chip are not be electrically connected can be achieved. <P>COPYRIGHT: (C)2013,JPO&INPIT |
