| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a powder dust removal method which is able to remove powder dusts residing in a separation kerf in a wafer. <P>SOLUTION: A powder dust removal method is a method for removing powder dusts from a plurality of separation kerfs in a wafer, in which an outer periphery of the wafer is adhered onto an adhesive tape adhered to an annular frame, and the wafer is divided into individual devices by the plurality of separation kerfs. The powder dust removal method includes: a frame support step in which an adhesive tape side on which the wafer is adhered is exposed downward; a discharge step for forcibly discharging powder dusts residing in the separation kerfs by electrically discharging form a discharger in discharge means placed below the adhesive tape, the discharge means is constituted of a commercial AC power supply, a voltage converter which converts an AC voltage from the commercial AC power supply into a high AC voltage, a frequency controller which controls a frequency of the high AC voltage, and the discharger provided with a plurality of discharge terminals connected to the frequency controller; and a cleaning step in which a surface of the wafer is cleaned to remove the discharged powder dusts from the surface of the wafer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
