substrate clamp of sputter and suptter method,申请号KR20050136022-传众专利搜索

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发明名称	substrate clamp of sputter and suptter method
摘要
申请公布号	KR101198821(B1)	申请公布日期	2012.11.09
申请号	KR20050136022	申请日期	2005.12.30
申请人		发明人
分类号	H01L21/687;H01L21/3065	主分类号	H01L21/687
代理机构		代理人
主权项
地址

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