| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a three-dimensional integrated circuit laminate which is filled with an interlaminar filler composition having both of high heat conductivity and low liner expansion. <P>SOLUTION: A three-dimensional integrated circuit laminate comprises: a semiconductor substrate laminate 1 formed by stacking at least two or more layers of semiconductor substrates 10, 20, and 30 in which a semiconductor device layers 11, 21, and 31 are formed thereon; and first interlaminar filler layers 40 and 50 containing a resin (A) and an inorganic filler (B) and having linear expansion coefficient of 5 ppm or higher and 70 ppm or lower between the semiconductor substrates 10, 20, and 30. <P>COPYRIGHT: (C)2013,JPO&INPIT |
