发明名称 |
STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACKAGE CONNECTOR |
摘要 |
A stack package includes a lower package including a lower package substrate and a lower semiconductor chip disposed on the lower package substrate, an upper package including an upper package substrate and an upper semiconductor chip disposed on the upper package substrate, a fastening element formed between a top surface of the lower semiconductor chip and a bottom surface of the upper package substrate, and a halogen-free inter-package connector connecting the lower package substrate to the upper package substrate.
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申请公布号 |
US2012280404(A1) |
申请公布日期 |
2012.11.08 |
申请号 |
US201213459843 |
申请日期 |
2012.04.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
KWON HEUNG-KYU;YOO JAE-WOOK;KIM HYON-CHOL;LEE SU-CHANG;NA MIN-OK |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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