发明名称 |
USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATIONS TO YIELD A LOW COST, SMALL SIZE CAMERA ON A CHIP |
摘要 |
According to some embodiments, a camera includes a multi-chip system in a package (MCSiP). The MCSiP comprising a set of electronics, an encapsulate, and a plurality of interconnects. The set of electronics includes a plurality of bare integrated circuit dies and other passive or active electronic components. Each die is operable to provide a functional component of a computing system operable to receive a signal describing electromagnetic radiation detected by an imaging sensor and facilitate generating an image according to the signal. The encapsulate comprises an adhesive molding compound deposited outwardly from the set of electronics in order to hold the set of electronics in position. The interconnects communicatively couple each die to other dies, the other electronic components, or components external to the MCSiP.
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申请公布号 |
US2012281113(A1) |
申请公布日期 |
2012.11.08 |
申请号 |
US201113164432 |
申请日期 |
2011.06.20 |
申请人 |
KENNEDY ADAM M.;BLACK STEPHEN H.;BAUR STEFAN THEODOR ANTON;RAYTHEON COMPANY |
发明人 |
KENNEDY ADAM M.;BLACK STEPHEN H.;BAUR STEFAN THEODOR ANTON |
分类号 |
H04N5/225;H01L31/18;H04N5/222;H04N5/76 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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