发明名称 CONDUCTIVE PASTE
摘要 <P>PROBLEM TO BE SOLVED: To provide a conductive paste which is capable of suppressing the occurrence of delamination and is excellent in printability. <P>SOLUTION: The conductive paste contains: a polyvinyl acetal resin containing a carboxylic acid-modified polyvinyl acetal resin; a conductive powder; and an organic solvent. The polyvinyl acetal resin has an average polymerization degree of 200-1500, a carboxyl group content of 0.05-1 mol%, and an acetoacetal group content of 5-30 mol%. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012216488(A) 申请公布日期 2012.11.08
申请号 JP20110203351 申请日期 2011.09.16
申请人 SEKISUI CHEM CO LTD 发明人 MORIGUCHI SHINTARO
分类号 H01B1/20;C08K3/00;C08L29/14;H01G4/12;H01G4/232 主分类号 H01B1/20
代理机构 代理人
主权项
地址