| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent reattachment of particles resulting from the substrate processing and improve the uniformity of the substrate processing. <P>SOLUTION: A liquid level in a processing tank is controlled so as to be lower than a substrate held in the processing tank, and a processing liquid is discharged in the air from a first discharge part included in first circulation means to the substrate in the processing tank. Thus, the substrate does not contact with the processing liquid accumulated in the processing tank, and the structure prevents particles included in the processing liquid that was used for the substrate processing from reattaching to the substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
