SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method that suppress damage to a substrate.

SOLUTION: The substrate treatment apparatus includes: a spin chuck for horizontally holding a substrate W ; a droplet nozzle 5 for generating droplets of a treatment liquid to be sprayed over a jet region T1 in an upper surface of the substrate W; and a protection liquid nozzle 6 for discharging a protection liquid protective of the substrate W at the upper surface of the substrate W. The protection liquid nozzle 6 discharges the protection liquid at a tilt to the upper surface of the substrate W such that the protection liquid flows down the upper surface of the substrate W toward the jet region T1, whereby the droplets of the treatment liquid impinge on the jet region T1 while the jet region T1 is covered with a liquid film of the protection liquid.

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