| 发明名称 |
BONDING COMPOSITION AND BOARD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding composition having high adhesion, from which formaldehyde is not readily released. <P>SOLUTION: The present invention relates to the bonding composition cured by heating/compression. The bonding composition contains a polyvalent carboxylic acid. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012214687(A) |
申请公布日期 |
2012.11.08 |
| 申请号 |
JP20110276986 |
申请日期 |
2011.12.19 |
| 申请人 |
PANASONIC CORP |
发明人 |
SUGAWARA AKIRA;UMEMURA KENJI |
| 分类号 |
C09J201/00;B27N3/00;C09J11/04;C09J11/06;C09J101/00 |
主分类号 |
C09J201/00 |
| 代理机构 |
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