发明名称 COMPOSITE PARTICLE, RESIN COMPOSITION AND CONNECTION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide novel composite particles which can be used as a conductive material or a thermally conductive material, and to provide a resin composition using the composite particles. <P>SOLUTION: The composite particles 1 comprise resin particles 2, and multiple conductive particles 3 buried in the resin particles 2 and having an average particle size smaller than 1/2 of the particle size of the resin particles 2. In the resin particles 2, the multiple conductive particles 3 are distributed unevenly. The number of the conductive particles 3 is larger on the outer surface 2a side of the resin particles 2 than on the center C side thereof. The resin composition contains the composite particles 1 and a binder resin. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012216295(A) 申请公布日期 2012.11.08
申请号 JP20110078972 申请日期 2011.03.31
申请人 SEKISUI CHEM CO LTD 发明人 NISHIOKA KEIZO
分类号 H01B5/00;C08K9/08;C08L101/00;C09J9/02;C09J201/00;H01B1/20;H01B5/16;H01R11/01 主分类号 H01B5/00
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