发明名称 CONDUCTING HEAT AWAY FROM A PRINTED CIRCUIT BOARD ASSEMBLY IN AN ENCLOSURE
摘要 A printed circuit board assembly (PCBA) is connected to a frame within a passage. The PCBA includes a circuitry package attached to a printed circuit board. The circuitry package has a peripheral edge extending from the printed circuit board to a distal end joined to a cap. A cover is attached to the frame to enclose the PCBA. A thermal interface material (TIM) is disposed between the cover and the PCBA, the TIM defining an opening sized to receivingly engage the circuitry package in a close mating engagement contacting the TIM simultaneously against the cap and the peripheral edge to conduct heat away from the circuitry package. A heat conductor attached to the other side of the printed circuit board in an overlapping opposition to the circuitry package conducts heat away from the printed circuit board that is generated by the circuitry package.
申请公布号 US2012281364(A1) 申请公布日期 2012.11.08
申请号 US201213467621 申请日期 2012.05.09
申请人 GUNDERSON NEAL FRANK;SEAGATE TECHNOLOGY LLC 发明人 GUNDERSON NEAL FRANK
分类号 H05K7/20;H05K13/00 主分类号 H05K7/20
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