| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method which can simply evaluate gettering capability of a resin film applied to a chip for adding gettering capability to a semiconductor chip. <P>SOLUTION: A resin film gettering capability evaluation method according to the present invention comprises: a process of forming the resin film on one surface of a silicon wafer; a process of heating a laminate of the resin film and the silicon wafer to a temperature of 200°C and over; and a process of determining a quantity of a heavy-metal element in a surface layer on the other surface side of the silicon wafer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
