| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photodiode array module in which reduction in the number of PDs per module is suppressed, and to provide a method of manufacturing the same. <P>SOLUTION: Since a first semiconductor substrate 1 and a second semiconductor substrate 2 are formed of different materials from each other, they are sensitive to incoming light with different wavelength bands from each other. Each photodiode of a photodiode array is connected to an amplifier of the first semiconductor substrate 1. According to this method, by etching the second semiconductor substrate 2 and then dicing the deepest part of its etching groove, the second semiconductor substrate 2 is separated from the wafer. A crystal defect density in a lateral face appeared by the etching is smaller than that appeared by the dicing. Since it is not required to remove a photodiode located at an end part of the second semiconductor substrate 2, reduction in the number of photodiodes can be suppressed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
