| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a component built-in printed circuit board with thin thickness, on which a chip component is surely held. <P>SOLUTION: In a component built-in printed circuit board, a chip component with a rectangular shape in a plane view is provided in a hole of a glass material containing organic resin core substrate. Four corners of the hole are spaced from four corners of the chip component, and four sides of the hole are in close and parallel contact with four sides of the chip component. A mass of particles of a glass material and resin scraped from the hole is accumulated between the hole and the chip component, and the four sides of the chip component are rigidly held in the hole. Both faces of a core substrate and the chip component are covered with a buildup layer, and a component electrode connection via hole reaching and electrically connected to an electrode terminal of the chip component from a surface of the buildup layer is formed by metal plating. <P>COPYRIGHT: (C)2013,JPO&INPIT |
