发明名称 THERMALLY EXPANDABLE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermally expandable resin composition, capable of closing a gap of building materials, a through-hole or the like even if it cannot be perfectly closed by the thermally expanded residue of the thermally expandable resin composition. <P>SOLUTION: [1] The thermally expandable resin composition includes: a thermally expanding component, a binder resin and an inorganic filler, the thermally expanding component includes a first thermally expanding component having a thermally expansion start temperature of 140-250&deg;C and a second thermally expanding component having a thermal expansion start temperature of 251-350&deg;C. [2] In the thermally expandable resin composition of [1], the first thermally expanding component is thermally expandable graphite having a thermal expansion start temperature of 140-250&deg;C, the second thermally expanding component is thermally expandable graphite having a thermal expansion start temperature of 251-350&deg;C, and the binder resin includes at least one selected from the group consisting of thermosetting resin, thermoplastic resin and rubber resin. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012214646(A) 申请公布日期 2012.11.08
申请号 JP20110081318 申请日期 2011.03.31
申请人 SEKISUI CHEM CO LTD 发明人 YAMAGUCHI BUNJI;TONO MASAKI;MIYATA SHINGO
分类号 C08L101/00;C08K3/00;C08K3/04 主分类号 C08L101/00
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