发明名称 |
CIRCUIT BOARD VIAHOLES AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the substrate; a plated layer comprising nickel and disposed on the conductive layer; and a viahole passing through the substrate, the conductive layer, and the plated layer, wherein a crystal growth direction of nickel in the plated layer is parallel to a thickness-wise direction of the substrate. |
申请公布号 |
US2012279775(A1) |
申请公布日期 |
2012.11.08 |
申请号 |
US201213542233 |
申请日期 |
2012.07.05 |
申请人 |
SHIM CHANG-HAN;KANG SUNG-IL;PARK SE-CHUEL;SAMSUNG TECHWIN CO., LTD. |
发明人 |
SHIM CHANG-HAN;KANG SUNG-IL;PARK SE-CHUEL |
分类号 |
H05K1/11;H05K3/42 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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