| 发明名称 |
COMPOSITE RESIN COMPOSITIONS |
| 摘要 |
<p>Disclosed are compositions that include an epoxy resin, a phenolic resin, a solvent, and a filler. These compositions may be used to produce prepreg materials, which materials remain in condition for layup processing after extended storage at ambient conditions.</p> |
| 申请公布号 |
WO2012151250(A1) |
申请公布日期 |
2012.11.08 |
| 申请号 |
WO2012US36074 |
申请日期 |
2012.05.02 |
| 申请人 |
UNIVERSITY OF HAWAII;HIHARA, LLOYD, H.;TIWARI, ATUL |
发明人 |
HIHARA, LLOYD, H.;TIWARI, ATUL |
| 分类号 |
B32B18/00;B32B27/04;B32B27/12;B32B27/38 |
主分类号 |
B32B18/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
