| 摘要 |
<P>PROBLEM TO BE SOLVED: To control transportation of a wafer according to a degree of microfabrication required for each lot. <P>SOLUTION: A substrate processing device comprises plural PMs 400 for applying predetermined processing to a wafer W, and an LLM 500, in which a transportation mechanism for transporting the wafer W is built. An EC 200 controls the substrate processing device. The A selection part 255 of the EC 200 selects the PM 400, to which the wafer is transported next, and also selects for each lot a unit of the wafer W transported to the same PM from one lot or one wafer according to a degree of microfabrication required for each lot. A transportation control part 260 of the EC 200 sequentially transports the wafers W included in a lot to the selected same PM 400 when transportation of a lot unit is selected, and sequentially OR-transports the wafers W included in the lot one by one from the selected PM 400 to the other PM 400 when transportation of a wafer unit is selected. <P>COPYRIGHT: (C)2013,JPO&INPIT |
